SOLDER PASTE 200G

Description

The 200g Solder Paste is a specialized soldering flux commonly used in electronics assembly, reflow soldering, and surface-mount technology (SMT) applications. This solder paste consists of a mixture of powdered solder alloy and flux, formulated to achieve precise and controlled soldering of small electronic components. The paste-like consistency allows for easy dispensing onto solder pads, providing an even distribution of solder material during reflow soldering processes. With its high-quality flux formulation, the solder paste helps remove oxides from metal surfaces, promoting excellent wetting and reliable solder joints. Whether you’re assembling printed circuit boards (PCBs) or repairing electronic devices, the 200g Solder Paste offers convenience and efficiency for achieving consistent and high-quality solder connections.